Precise [100] crystal orientation determination on 〈1107rang;-oriented silicon wafers

Journal of Micromechanics and Microengineering

Volumn 13, Issue 1, 2003, Pages 47-52

  Tseng, Fan Gang ^a   Chang, Kai Chen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; ETCHING; FABRICATION; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

BULK ETCHING;

SILICON WAFERS;

EID: 0037233887     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/1/307     Document Type: Article

References (5)

1. Ensell G 1996 Alignment of mask patterns to crystal orientation Sensors Actuators A 53 345-8
2. Schroder H, Dorsch O and Obermeier E 1996 An improved method to align etchmasks to the 〈110〉 crystal orientation Microsyst. Technol. 96 651-5
3. Steckenborn A et al 1991 High precision wafer orientation for micromachining Microsyst. Technol. 91 467-71
4. Lai J M, Chieng W H and Huang Y-C 1998 Precision alignment of mask etching with respect to crystal orientation J. Micromech. Microeng. 8 327-9
5. Tseng F-G and Chang K-C 2001 A precision alignment method to 〈100〉 direction on (110) silicon wafer ASME IMECE01/MEMS23859, New York, USA, 2001