Temperature dependence of microstructure and hardness of vacuum plasma sprayed Cu-Mo composite coatings

Surface and Coatings Technology

Volumn 200, Issue 20-21, 2006, Pages 5682-5686

  Ok Chwa, Sang ^a   Klein, Didier ^a   Liao, Hanlin ^a   Dembinski, Lucas ^a   Coddet, Christian ^a  

^a UNIVERSITÉ DE TECHNOLOGIE DE BELFORT MONTBÉLIARD   (France)

Author keywords

Cu Mo composite; Heat spreader; Microhardness; Microstructure; Thermal spray

Indexed keywords

COPPER ALLOYS; HEAT TRANSFER; METALLIC MATRIX COMPOSITES; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMAL EXPANSION; VOLUME FRACTION;

COMPOSITE COATINGS; TEMPERATURE DEPENDENCE; THERMAL EXPANSION COEFFICIENTS; THERMAL SPRAY; VACUUM PLASMA SPRAYED COATINGS;

PLASMA SPRAYING;

COPPER ALLOYS; HEAT TRANSFER; METALLIC MATRIX COMPOSITES; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; PLASMA SPRAYING; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMAL EXPANSION; VOLUME FRACTION;

EID: 33646490119     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.08.114     Document Type: Article

References (22)

1. Shammas N.Y.A. Microelectron. Reliab. 43 (2003) 519
2. Lostetter A.B., Barlow F., and Elshabini A. Microelectron. Reliab. 40 (2000) 365
3. Hocine R., Boudghene Stambouli A., and Saidane A. Microelectron. Eng. 65 (2003) 293
4. Ye H., Lin M., and Basaran C. Finite Elem. Anal. Des. 38 (2002) 601
5. Haque S., Stinnett W.A., Nelson D.J., and Lu G.Q. Microelectron. Reliab. 39 (1999) 1343
6. Jech D.E., and Sepulveda J.L. Proceedings of the 1997 IMAPS Conference, Philadelphia, PA (1997) 72-77
7. Romero G.L., and Martinez J.L. Proceedings of the ISHM Conference, Boston, MA (1994) 421-426
8. Arikawa T., Ichida A., and Takegoshi E. J. Soc. Mater. Sci., Jpn. 48 (1999) 295
9. In: Massalski T.B., Okamoto H., Subramanian P.R., and Kacprzak L. (Eds). Binary Alloy Phase Diagram. 2nd ed. (1990), ASM International, Materials Park, OH
10. Zhao B., Li D.M., Zeng F., and Pan F. Appl. Surf. Sci. 207 (2003) 334
11. Alvarez-Fregoso O., Lopez S., Juarez-Isalas J.A., Garcia M., Martinez E., Alvarez-Perez M.A., Ramirez J.Ch., and Granados S. Phys. Status Solidi, B Basic Res. 220 (2000) 575
12. Ki K.H., and Bong K.S. Surf. Coat. Technol. 182 1 (2004) 124
13. Ki K.H., and Bong K.S. J. Therm. Spray Technol. 13 2 (2004) 223
14. Fang J.C., and Xu W.J. J. Mater. Process. Technol. 129 (2002) 288
15. Zhang H., Wang G., Luo Y., and Nakaga T. Thin Solid Films 390 (2001) 7
16. Gopalakrishnan M.V., Metzgar K., Rosetta D., and Krishnamurthy R. J. Mater. Process. Technol. 135 (2003) 228
17. Otsu N. IEEE Trans. Syst. Man. Cybern. 9 (1979) 62
18. Wahl K.J., Seitzman L.E., Bolster R.N., Singer I.L., and Peterson M.B. Surf. Coat. Technol. 89 (1997) 245
19. Eckert J., Reger-Leonhard A., Weiß B., and Heilmaier M. Mater. Sci. Eng., A Struct. Mater.: Prop. Microstruct. Process. 301 (2001) 1
20. Vardelle A., Vardelle M., Zhang H., Themelis N.J., and Gross K. J. Therm. Spray Technol. 11 (2002) 244
21. Matejicek J., and Sampath S. Acta Mater. 49 (2001) 1993
22. Hass D.D., Slifka A.J., and Wadley H.N.G. Acta Mater. 49 (2001) 973