Present problems of power module packaging technology

Microelectronics Reliability

Volumn 43, Issue 4, 2003, Pages 519-527

  Shammas, N Y A ^a  

^a STAFFORDSHIRE UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; QUALITY CONTROL; RELIABILITY;

SEMICONDUCTOR PACKAGES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0037382513     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00019-2     Document Type: Conference Paper

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