Ion beam induced formation of metastable alloy phases in Cu-Mo system during ion beam assisted deposition

Applied Surface Science

Volumn 207, Issue 1-4, 2003, Pages 334-340

  Zhao, B ^a   Li, D M ^a   Zeng, F ^a   Pan, F ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Ion beam assisted deposition; Metastable bcc Cu; Microstructure evolution; Solid solution

Indexed keywords

ARGON; COMPOSITION; ION BEAM ASSISTED DEPOSITION; MICROSTRUCTURE; POSITIVE IONS; SOLID SOLUTIONS;

METASTABLE ALLOYS;

COPPER ALLOYS;

EID: 0037470532     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)01526-X     Document Type: Article

References (18)

1. Liu B.X., Lai W.S., Zhang Q. Mater. Sci. Eng., R. 29:2000;1.
2. Liu B.X., Johnson W.L., Nicolet M.-A., Lau S.S. Appl. Phys. Lett. 42:1983;45.
3. Knapp J.A., Follstaedt D.M. Phys. Rev. Lett. 55:1983;415.
4. Hirvonen J.K. Mater. Sci. Rep. 6:1991;215.
5. Smidt F.A. Int. Mater. Rev. 35:1990;61.
6. Hirvonen J.K. Surf. Coat. Technol. 65:1994;84.
7. Sonnenberg N., Longo A.S., Cima M.J., Chang B.P., Ressler K.G., McIntyre P.C., Liu Y.P. J. Appl. Phys. 74(2):1993;1027.
8. Ding M., Zeng F., Pan F. Nucl. Instrum. Methods Phys. Res., Sect. B. 170:2000;79.
9. Zhao B., Zeng F., Pan F. Jpn. J. Appl. Phys. 40:2001;5369.
10. F.R. de Boer, R. Boom, W.C.M. Matters, A.R. Miedema, A.K. Niessen, Cohesion in Metals: Transition Metal Alloys, North Holland, Amsterdam, 1989.
11. T.B. Massalski, H. Okamoto, P.R. Subramanian, L. Kacprzak (Eds.), Binary Alloy Phase Diagram, 2nd ed., ASM International, Materials Park, OH, 1990.
12. Chen Y.G., Liu B.X. J. Alloys Comp. 261:1997;217.
13. Liu B.X., Jin O. Phys. Status Solidi A. 161:1997;3.
14. Niessen A.K., Miedema A.R., de Boer F.R., Boom R. Physica B. 151:1998;401.
15. Alonso J.A., Gallego L.J., Simozar J.A. Nuovo Cimento D. 12(4-5):1990;587.
16. Nordlund K., Averback R.S. Phys. Rev. B. 59:1999;20.
17. Li Y.Z., Li T., Zhang Y.H., Wu L.W., Gao C., Liu W.H. J. Phys. Condens. Mater. 8:1996;7191.
18. Pan F., Zhang M., Liu B.X. Thin Solid Films. 334(1-2):1998;196.