Via-filling by copper electroplating using stepwise current control

Electrochemistry

Volumn 74, Issue 3, 2006, Pages 212-215

  Oyamada, Kimiko ^a   Koiwa, Ichiro ^a   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Additives; Cu Plating; Current Control; Via filling

Indexed keywords

ADDITIVES; ASPECT RATIO; CURRENT DENSITY; DEPOSITION; ELECTRIC CURRENT CONTROL; ELECTROCHEMISTRY; ELECTROPLATING; FILLING;

COPPER ELECTROPLATING BATH; PREFERENTIAL DEPOSITION; VIA-FILLING; VIA-HOLES;

COPPER PLATING;

EID: 33646390396     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.74.212     Document Type: Article

References (16)

1. Y. Tsukada, J. Jpn. Inst. Pack. Electro. Circuit, 11, 306 (1996).
2. S. Honda, J. Jpn. Inst. Pack. Electro. Circuit, 11, 462 (1996).
3. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. & Devel., 42, 567 (1998).
4. J. J. Kelly and A. C. West, J. Electrochem. Soc., 145 (10) (1998).
5. Y. Takada, K. Oyamada, S. Miura, and H. Honma, J. Jpn. Inst. Electronics Pack., 4, 219 (2001).
6. V. S. Donepudi, R. Venkatachalapathy, P. O. Ozemoyah, C. S. Johnson, and J. Prakash, Electrochem. Solid-State Lett., 4, C13 (2001).
7. P. Taephaisitphongse, Y. Cao, and A. C. West, J. Electrochem. Soc., 148, C492 (2001).
8. M. Georgiadou, D. Veyret, R. L. Sani, and R. C. Alkire, J. Electrochem. Soc., 148, C54 (2001).
9. H. Nawafune, H. Kitamura, S. Mizumoto, E. Uchida, and T. Okada, J. Surf. Fin. Soc. Jpn., 51, (2000).
10. S. Miura, K. Oyamada, Y. Takada, and H. Honma, Electrochemistry 69, 773 (2001).
11. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, and D. Josell, J. Electrochem. Soc., 147, 4524 (2000).
12. S. Shingubara, Z. Wang, O. Yaegashi, R. Obara, H. Sakae, and T. Takahagi, Electrochem. Solid-State Letters, 7, C78 (2004).
13. M. Hasegawa, Y. Negishi, T. Nakanishi, and T. Osaka, J. Electrochem. Soc., 152, C221 (2005).
14. T. Kobayashi, J. Kawasaki, K. Mihara, T. Yamashita, and H. Honma, J. Jpn. Inst. Electronics Pack., 3, 4 (2000).
15. S. Miura, K. Mihara, T. Fukushi, and H. Honma, J. Jpn. Inst. Electronics Pack., 5, 3 (2002).
16. K. Oyamada, H. Nishinakayama, M. Akiyama, S. Miura, and H. Honma, J. Jpn. Inst. Electronics Pack., 6, 228 (2003).