Copper Electroplating for Via-Hole and Through-Hole Co-Existed Circuit Boards

Journal of Japan Institute of Electronics Packaging

Volumn 6, Issue 3, 2003, Pages 228-233

  Oyamada, Kimiko ^a   Miura, Shuhei ^a   Nishinakayama, Hiroshi ^a   Akiyama, Miki ^a   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Additive; Copper Electroplating; Printed Circuit Boards; Through Hole; Via Hole

Indexed keywords

EID: 84964202037     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.6.228     Document Type: Article

References (2)

1. S. Miura, K. Oyamada, Y. Takada, H. Honma: “ULSI Wiring Formation by Copper Electroplating in the Presence of Additives”, Electrochemistry, Vol. 69, No. 10, pp. 773-777, 2001.
2. G. Sauerbrey: “Verwendung von Schwingquarzen zur Wagung dunner Schichten und zur Microwagang”, Vol. 155, pp. 206-212, 1959.