Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films

Materials Science and Engineering: A

Volumn 423, Issue 1-2, 2006, Pages 107-110

  Chen, Zhong ^a   He, Min ^a   Balakrisnan, Bavani ^b   Chum, Chan Choy ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Elasticity modulus; Fracture toughness; Indentation hardness; Intermetallic compound; Thin film

Indexed keywords

ANNEALING; DENSIFICATION; ELASTIC MODULI; FRACTURE TOUGHNESS; HARDNESS; INDENTATION; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; NICKEL ALLOYS; SPUTTERING; TENSILE STRESS; THIN FILMS;

INTERFACIAL REACTION; METALLIZATION MATERIALS; MICROELECTRONIC SOLDER;

INTERMETALLICS;

ANNEALING; DENSIFICATION; ELASTIC MODULI; FRACTURE TOUGHNESS; HARDNESS; INDENTATION; INTERFACES (MATERIALS); INTERMETALLICS; MECHANICAL PROPERTIES; NICKEL ALLOYS; SPUTTERING; TENSILE STRESS; THIN FILMS;

EID: 33646161938     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.12.038     Document Type: Article

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