-
1
-
-
0030688459
-
Fabry-Perot pressure sensor arrays for imaging surface pressure distributions
-
Kluwer
-
M. F. Miller, M. G. Allen, E. Arkilic, K. S. Breuer, and M. A. Schmidt, "Fabry-Perot pressure sensor arrays for imaging surface pressure distributions," in Proceedings of International Conference on Solid-State Sensors and Actuators (Kluwer, 1997), pp. 1469-1472.
-
(1997)
Proceedings of International Conference on Solid-state Sensors and Actuators
, pp. 1469-1472
-
-
Miller, M.F.1
Allen, M.G.2
Arkilic, E.3
Breuer, K.S.4
Schmidt, M.A.5
-
2
-
-
0035304687
-
Optically interrogated MEMS pressure sensors for propulsion applications
-
J. Zhou, S. Dasgupta, H. Kobayashi, J. M. Wolff, H. E. Jackson, and J. T. Boyd, "Optically interrogated MEMS pressure sensors for propulsion applications," Opt. Eng. 40, 598-604 (2001).
-
(2001)
Opt. Eng.
, vol.40
, pp. 598-604
-
-
Zhou, J.1
Dasgupta, S.2
Kobayashi, H.3
Wolff, J.M.4
Jackson, H.E.5
Boyd, J.T.6
-
3
-
-
1642619062
-
Multiplexed sensor system for simultaneous measurement of pressure and temperature
-
W. Li, D. C. Abeysinghe, and J. T. Boyd, "Multiplexed sensor system for simultaneous measurement of pressure and temperature," Opt. Eng. 43, 148-156 (2004).
-
(2004)
Opt. Eng.
, vol.43
, pp. 148-156
-
-
Li, W.1
Abeysinghe, D.C.2
Boyd, J.T.3
-
4
-
-
0031060751
-
Diaphragm deflection of silicon interferometer structures used as pressure sensors
-
Z. Xiao, U. O. Engström, and N. Vidovic, "Diaphragm deflection of silicon interferometer structures used as pressure sensors," Sens. Actuators A 58, 99-107 (1997).
-
(1997)
Sens. Actuators A
, vol.58
, pp. 99-107
-
-
Xiao, Z.1
Engström, U.O.2
Vidovic, N.3
-
5
-
-
0012454464
-
Fiber-optic temperature sensor using a thin film Fabry-Perot interferometer
-
Lewis Research Center
-
G. Beheim, "Fiber-optic temperature sensor using a thin film Fabry-Perot interferometer," NASA Tech. Memo. TM-107459 (Lewis Research Center, 1997).
-
(1997)
NASA Tech. Memo.
, vol.TM-107459
-
-
Beheim, G.1
-
6
-
-
0037387686
-
Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology
-
Y. Huang, S. Ergun, E. Haeggström, M. H. Badi, and B. T. Khuri-Yakub, "Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology," J. Microelctromech. Syst. 12, 128-137 (2003).
-
(2003)
J. Microelctromech. Syst.
, vol.12
, pp. 128-137
-
-
Huang, Y.1
Ergun, S.2
Haeggström, E.3
Badi, M.H.4
Khuri-Yakub, B.T.5
-
7
-
-
0036571758
-
Novel MEMS pressure and temperature sensors fabricated on optical fibers
-
D. C. Abeysinghe, S. Dasgupta, H. E. Jackson, and J. T. Boyd, "Novel MEMS pressure and temperature sensors fabricated on optical fibers," J. Micromech. Microeng. 12, 229-135 (2002).
-
(2002)
J. Micromech. Microeng.
, vol.12
, pp. 229-1135
-
-
Abeysinghe, D.C.1
Dasgupta, S.2
Jackson, H.E.3
Boyd, J.T.4
-
8
-
-
0037343019
-
Anodic bonding of optical fibers-to-silicon for integrating MEMS devices and optical fibers
-
A. Saran, D. C. Abeysinghe, R. Flenniken, and J. T. Boyd, "Anodic bonding of optical fibers-to-silicon for integrating MEMS devices and optical fibers," J. Micromech. Microeng. 13, 346-351 (2003).
-
(2003)
J. Micromech. Microeng.
, vol.13
, pp. 346-351
-
-
Saran, A.1
Abeysinghe, D.C.2
Flenniken, R.3
Boyd, J.T.4
-
11
-
-
0043132312
-
Fiber-linked interferometric pressure sensor
-
G. Beheim, K. Fritsch, and R. N. Poorman, "Fiber-linked interferometric pressure sensor," Rev. Sci. Instrum. 58, 1655-1659 (1987).
-
(1987)
Rev. Sci. Instrum.
, vol.58
, pp. 1655-1659
-
-
Beheim, G.1
Fritsch, K.2
Poorman, R.N.3
-
13
-
-
4444366284
-
A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging
-
D. C. Abeysinghe, V. Ranatunga, A. Balagopal, H. Mu, and D. Klotzkin, "A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging," IEEE Photon. Technol. Lett. 16, 2150-2152 (2004).
-
(2004)
IEEE Photon. Technol. Lett.
, vol.16
, pp. 2150-2152
-
-
Abeysinghe, D.C.1
Ranatunga, V.2
Balagopal, A.3
Mu, H.4
Klotzkin, D.5
-
14
-
-
33645789985
-
Wired fiber: Field assisted bonding of fiber to silicon submounts for optoelectronics for epoxy-free passive alignment and low-cost packaging
-
invited talk, Cleveland, Ohio 7-11 June
-
D. C. Abeysinghe, V. Ranatunga, A. Balagopal, H. Mu, A. Saran, J. T. Boyd, and D. Klotzkin, "Wired fiber: field assisted bonding of fiber to silicon submounts for optoelectronics for epoxy-free passive alignment and low-cost packaging," invited talk at the Great Lakes Photonics Symposium, Cleveland, Ohio 7-11 June 2004.
-
(2004)
Great Lakes Photonics Symposium
-
-
Abeysinghe, D.C.1
Ranatunga, V.2
Balagopal, A.3
Mu, H.4
Saran, A.5
Boyd, J.T.6
Klotzkin, D.7
-
15
-
-
0002736868
-
Analysis of a low-finesse Fabry-Perot sensing interferometer illuminated by a multimode optical fiber
-
F. Perennes, P. C. Beard, and T. N. Mills, "Analysis of a low-finesse Fabry-Perot sensing interferometer illuminated by a multimode optical fiber," Appl. Opt. 38, 7026-7034 (1999).
-
(1999)
Appl. Opt.
, vol.38
, pp. 7026-7034
-
-
Perennes, F.1
Beard, P.C.2
Mills, T.N.3
-
16
-
-
0026245019
-
Development of medical pressure and temperature sensors employing optical spectrum modulation
-
R. A. Wolthius, G. L. Mitchell, E. Saaski, J. C. Haitl, and M. A. Afromowitz, "Development of medical pressure and temperature sensors employing optical spectrum modulation," IEEE Trans. Biomed. Eng. 38, 974-981 (1991).
-
(1991)
IEEE Trans. Biomed. Eng.
, vol.38
, pp. 974-981
-
-
Wolthius, R.A.1
Mitchell, G.L.2
Saaski, E.3
Haitl, J.C.4
Afromowitz, M.A.5
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