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Volumn 58, Issue 2, 1997, Pages 99-107

Diaphragm deflection of silicon interferometer structures used as pressure sensors

Author keywords

Diaphragms; Interferometers; Optical fibers; Pressure sensors; Silicon

Indexed keywords

DIAPHRAGMS; FIBER OPTIC SENSORS; FINITE ELEMENT METHOD; INTERFEROMETERS; SILICON WAFERS;

EID: 0031060751     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(96)01398-2     Document Type: Article
Times cited : (16)

References (19)
  • 1
    • 0023043012 scopus 로고
    • Wafer bonding for silicon-on-insulator technology
    • J.B. Lasky, Wafer bonding for silicon-on-insulator technology, Appl. Phys. Lett., 48 (1986) 18.
    • (1986) Appl. Phys. Lett. , vol.48 , pp. 18
    • Lasky, J.B.1
  • 4
    • 0028406693 scopus 로고
    • A fiber optical voltage sensor prepared by micromachining and wafer bonding
    • Z. Xiao, S. Norman and O. Engström, A fiber optical voltage sensor prepared by micromachining and wafer bonding, Sensors and Actuators A, 41-42 (1994) 334-337.
    • (1994) Sensors and Actuators A , vol.41-42 , pp. 334-337
    • Xiao, Z.1    Norman, S.2    Engström, O.3
  • 5
    • 0025399110 scopus 로고
    • A balanced dual-diaphragm resonant pressure sensor in silicon
    • E. Stemme and G. Stemme, A balanced dual-diaphragm resonant pressure sensor in silicon, IEEE Trans. Electron. Dev., ED-37 (1990) 648.
    • (1990) IEEE Trans. Electron. Dev. , vol.ED-37 , pp. 648
    • Stemme, E.1    Stemme, G.2
  • 6
    • 0025698136 scopus 로고
    • A balanced resonant pressure sensor
    • E. Stemme and G. Stemme, A balanced resonant pressure sensor, Sensors and Actuators, A21-A23 (1990) 336-341.
    • (1990) Sensors and Actuators , vol.A21-A23 , pp. 336-341
    • Stemme, E.1    Stemme, G.2
  • 7
    • 0028426444 scopus 로고
    • A micromachined pressure sensor with fiber-optic interferometric readout
    • M.A. Chan, S.D. Collins and R.L. Smith, A micromachined pressure sensor with fiber-optic interferometric readout, Sensors and Actuators A, 43 (1994) 196-201.
    • (1994) Sensors and Actuators A , vol.43 , pp. 196-201
    • Chan, M.A.1    Collins, S.D.2    Smith, R.L.3
  • 8
    • 0025698122 scopus 로고
    • A novel pressure sensor structure for integrated sensors
    • [ 8] Y. Wang, L. Liu, X. Zheng and Z. Li, A novel pressure sensor structure for integrated sensors, Sensors and Actuators, A21-A23 (1990) 62-64.
    • (1990) Sensors and Actuators , vol.A21-A23 , pp. 62-64
    • Wang, Y.1    Liu, L.2    Zheng, X.3    Li, Z.4
  • 9
    • 0025416022 scopus 로고
    • Silicon fusing bonding for fabrication of sensors, actuators and microstructures
    • P.W. Barth, Silicon fusing bonding for fabrication of sensors, actuators and microstructures, Sensors and Actuators, A21-A23 (1990) 919-926.
    • (1990) Sensors and Actuators , vol.A21-A23 , pp. 919-926
    • Barth, P.W.1
  • 10
    • 0025698114 scopus 로고
    • Passive silicon transensor intended for biomedical, remote pressure monitoring
    • Y. Bäcklund, L. Rosengren, B. Hök and B. Svedbergh, Passive silicon transensor intended for biomedical, remote pressure monitoring, Sensors and Actuators, A21-A23 (1990) 58-61.
    • (1990) Sensors and Actuators , vol.A21-A23 , pp. 58-61
    • Bäcklund, Y.1    Rosengren, L.2    Hök, B.3    Svedbergh, B.4
  • 11
    • 85033099791 scopus 로고    scopus 로고
    • The influence of pressure on the optical properties of artificial microcavities in silicon
    • submitted to
    • Z. Xiao, O. Engström and N. Vidovic, The influence of pressure on the optical properties of artificial microcavities in silicon, submitted to Semicon. Sci. Technol.
    • Semicon. Sci. Technol.
    • Xiao, Z.1    Engström, O.2    Vidovic, N.3
  • 12
    • 85033101314 scopus 로고    scopus 로고
    • The influence of en electric field on the optical properties of artificial microcavities in silicon
    • submitted to
    • Z. Xiao and O. Engström, The influence of en electric field on the optical properties of artificial microcavities in silicon, submitted to J. Appl. Phys.
    • J. Appl. Phys.
    • Xiao, Z.1    Engström, O.2
  • 13
    • 85033108671 scopus 로고    scopus 로고
    • An optical modulator prepared by silicon micromachining and thermal bonding
    • submitted to
    • Z. Xiao and O. Engström, An optical modulator prepared by silicon micromachining and thermal bonding, submitted to IEEE Trans. Electron. Dev.
    • IEEE Trans. Electron. Dev.
    • Xiao, Z.1    Engström, O.2
  • 14
    • 84949083794 scopus 로고
    • A high sensitivity integrated-circuit capacitive pressure transducer
    • W.H. Ko, M.H. Bao and Y.D. Yang, A high sensitivity integrated-circuit capacitive pressure transducer, IEEE Trans. Electron. Dev., ED-29 (1982) 48-56.
    • (1982) IEEE Trans. Electron. Dev. , vol.ED-29 , pp. 48-56
    • Ko, W.H.1    Bao, M.H.2    Yang, Y.D.3
  • 15
    • 0018029736 scopus 로고
    • Dynamic micromechanics on silicon: Techniques and devices
    • K. Petersen, Dynamic micromechanics on silicon: techniques and devices, IEEE Trans. Electron. Dev., ED-25 (1978) 1241.
    • (1978) IEEE Trans. Electron. Dev. , vol.ED-25 , pp. 1241
    • Petersen, K.1
  • 17
    • 0346042038 scopus 로고
    • Swanson Analysis Systems, Inc.
    • ANSYS User's Manual, Vol. IV, Swanson Analysis Systems, Inc., 1992, p. 2-1.
    • (1992) ANSYS User's Manual , vol.4 , pp. 2-11
  • 19
    • 0020127035 scopus 로고
    • Silicon as a mechanical material
    • K.E. Petersen, Silicon as a mechanical material, Proc. IEEE, 70 (1982) 420.
    • (1982) Proc. IEEE , vol.70 , pp. 420
    • Petersen, K.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.