The joy off SOI: As viewed from a backside Focused Ion Beam (FIB) perspective

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2005, Issue , 2005, Pages 78-83

  Herschbein, Steven ^a   Rue, Chad ^a   Scruodato, Carmelo ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POTENTIAL; ION BEAMS; SEMICONDUCTOR MATERIALS; TARGETS;

FLOOR VOLTAGE CONTRAST PHENOMENA; FOCUSED ION BEAM (FIB); SOI PRODUCT;

SILICON ON INSULATOR TECHNOLOGY;

EID: 33645671735     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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3. R. Ring, et al, "FIB Applications for Flip Chip Packaged ICs," EDFAS News, February 2001, pp. 32-36
4. W. Tompson, et al, "A Novel Optical End Pointing Technique Applied to Backside FIB Editing," J. Vac. Sci. Technology, B 21, 2003.
5. th ISTFA, Santa Clara, CA, Nov. 2003, pp. 331-337.
6. R. Richmond, "Silicon on Insulator Technology," SysOpt.com web page, a Jupiter Media Corporation news site, Nov. 8, 2000.
7. th ISTFA, Worcester, MA, Nov. 2004, pp. 166-171.
8. th IRPS, Denver, CO, April 1997, pp. 72-81.
9. th ISTFA, Dallas TX, Nov. 1998, pp. 49-55.
10. th ISTFA, Santa Clara, CA, Nov. 2001, pp. 288-298.