Modeling and Optimizing XeF 2-enhanced FIB Milling of Silicon

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 255-261

  Bassom, Neil J ^a   Mai, Tung ^a  

^a Micrion Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP TECHNOLOGIES; FOCUSED ION BEAMS (FIB);

ASPECT RATIO; CHEMICAL REACTIONS; CURRENT DENSITY; FAILURE ANALYSIS; ION BEAMS; OPTIMIZATION; SPUTTERING; XENON;

SILICON;

EID: 1542360716     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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