Controlling solder joint voiding in BGA assembly

Surface mount technology

Volumn 12, Issue 4, 1998, Pages

  O'Hara, Wanda B ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUXES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; SOLDERED JOINTS; SOLVENTS; X RAY ANALYSIS;

BALL GRID ARRAY; REFLOW PROFILE; SOLDER BUMPS; SOLDER JOINT VOIDS; SOLDER PASTES; SOLDER POWDERS; SOLVENT VOLATILITY;

PRINTED CIRCUIT MANUFACTURE;

EID: 0032045668     PISSN: 08933588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)