The depletion/wetting of the low melting point alloy in electrically conductive adhesives (ECAs)

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 318-321

  Wu, J ^a   Moon, K S ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS INDUSTRY; LEAD; SUBSTRATES; SURFACE TENSION;

ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);

ADHESIVES;

EID: 0035019041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)