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Volumn , Issue , 2006, Pages 193-198
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Study of Pt addition to solve NiSi integration issues on CMOS devices
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Author keywords
[No Author keywords available]
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Indexed keywords
CMOS INTEGRATED CIRCUITS;
FABRICATION;
NICKEL COMPOUNDS;
NUCLEATION;
OXIDATION RESISTANCE;
PLATINUM;
SCANNING ELECTRON MICROSCOPY;
X RAY DIFFRACTION;
ELECTRIC RESISTANCE;
NICKEL ALLOYS;
OXIDATION;
THERMODYNAMIC STABILITY;
X RAY DIFFRACTION ANALYSIS;
CMOS FABRICATION;
CONTACT RESISTANCE;
DEFECT FORMATION;
SHEET RESISTANCE;
CMOS DEVICES;
XRD PATTERN ANALYSIS;
ADDITION REACTIONS;
PLATINUM;
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EID: 33644963195
PISSN: 15401766
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (11)
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References (11)
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