Vapor pressure and voiding effects on thin film damage

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 325-330

  Chew, H B ^a   Guo, T F ^a   Cheng, L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Discrete voids; Thin film; Vapor pressure; Void shape

Indexed keywords

ADHESIVES; COMPUTATION THEORY; MATHEMATICAL MODELS; POLYMERS; SOLDERING; THIN FILMS;

ADHESIVE DAMAGE; DISCRETE VOIDS; VAPOR PRESSURES; VOID SHAPES;

VAPORS;

EID: 33644879422     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.054     Document Type: Conference Paper

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