High- reliability nonconductive adhesives for flip chip interconnections

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 34-38

  Kwon, Woon Seong ^a   Jang, Kyung Woon ^a   Paik, Kyung Wook ^a   Yim, Myung Jin ^b   Hwang, Jin Sang ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Telephus Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING; ENVIRONMENTAL TESTING; FILLERS; FLIP CHIP DEVICES; MODIFIED ATMOSPHERE PACKAGING; PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SOLDERING ALLOYS; STRESSES; SUBSTRATES; TEMPERATURE; THERMAL CYCLING;

ELECTRICAL PERFORMANCE; FLIP-CHIP INTERCONNECTION; HIGH TEMPERATURE STORAGE TEST; LOW TEMPERATURE PROCESSING; NON-CONDUCTIVE ADHESIVES; PRINTED CIRCUIT BOARD (PCBS); THERMAL CYCLING RELIABILITY; THERMAL CYCLING TEST;

CHIP SCALE PACKAGES;

EID: 84960393318     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983954     Document Type: Conference Paper

References (6)

1. th International Microelectronics Conference, pp. 324-327, 1996
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3. J. Liu, A. Tolvgard, J. Malmodin, and Z. Lai, "A Reliable and Environmentally Friendly Packaging Technology-Flip Chip Joining Using Anisotropically Conductive Adhesive", IEEE Trans. Comp. Packag., Manufact. Technol. Vol. 22, No. 2, pp.186-190, 1999
4. M. J. Yim, Y. D. Jeon, and K. W. Paik, "Flip Chip Assembly on Organic Board using Anisotropic Conductive Adhesives/Films and Nickel/Gold Bump", in Proc. of InterPACK'99, 1999
5. Hideki Kasamitsu. et al, "The Flip-Chip Bump Interconnection for Millimeter-Wave GaAs MMIC", IEEE Trans. Electronics Packaging Manufacturing, Vol. 22, No. 1 (1999), pp.23-28
6. L. Crane, A. Torres-Filho, C. K. Ober, S. Yang, J. Chen, and R. W. Johnson, "Development of Reworkable Underfills, Materials, Reliability and Processing", IEEE Trans. Comp. Packag., Manufact. Technol. Vol. 22, No. 2, pp.163-167, 1999