Mechanical and electrical properties of electroplated copper for MR-imaging coils

Microsystem Technologies

Volumn 12, Issue 4, 2006, Pages 343-351

  Uelzen, Th ^a   Fandrey, S ^a   Muller J ^a  

^a HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COPPER; CURRENT DENSITY; ELECTROPLATED PRODUCTS; MAGNETIC RESONANCE IMAGING; TENSILE TESTING;

MR-IMAGING COILS; PLANAR POLYIMIDE FOILS;

METALLIC FILMS;

EID: 33644542724     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0069-8     Document Type: Article

References (13)

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