Microstructuring characteristics of a chemically amplified photoresist synthesized for ultra-thick UV-LIGA applications

Journal of Micromechanics and Microengineering

Volumn 14, Issue 8, 2004, Pages 1126-1134

  Yang, Chii Rong ^a   Hsieh, Gen Wen ^b   Hsieh, Yu Sheng ^b   Lee, Yu Der ^c  

^a NATIONAL TAIWAN NORMAL UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFICATION; COPOLYMERIZATION; ELECTROFORMING; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; ORGANIC SOLVENTS; SCANNING ELECTRON MICROSCOPY; SYNTHESIS (CHEMICAL); THICK FILMS;

CHEMICALLY AMPLIFICATION (CA); DEEP X-RAY LITHOGRAPHY (DXRL); MICROELECROMECHANICAL SYSTEM (MEMS); UV-LIGA PROCESS;

PHOTORESISTS;

EID: 4243178127     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/8/002     Document Type: Article

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