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Materials Science and Technology

Volumn 17, Issue 9, 2001, Pages 1033-1038

Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits

(2) Keong, K G a Sha, W a

a QUEEN'S UNIVERSITY BELFAST (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER;

ANALYTIC METHOD; FILM; MEASUREMENT; RELIABILITY; REPRODUCIBILITY; REVIEW; TENSILE STRENGTH;

EID: 0034801220 PISSN: 02670836 EISSN: None Source Type: Journal
DOI: 10.1179/026708301101510988 Document Type: Review

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.