Growth stresses and viscosity of thermal oxides on silicon and polysilicon

Journal of Materials Research

Volumn 21, Issue 1, 2006, Pages 209-214

  Kahn, H ^a   Jing, N ^a   Huh, M ^a   Heuer, A H ^a  

^a Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; MICROELECTROMECHANICAL DEVICES; OXIDATION; POLYSILICON; SINGLE CRYSTALS; STRAIN GAGES; VISCOELASTICITY;

GROWTH STRESSES; MICROELECTROMECHANICAL SYSTEMS-BASED MICROSTRAIN; THERMAL OXIDES;

SILICA;

EID: 33644521222     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0017     Document Type: Article

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