A low-loss silicon-on-silicon DC-110-GHz resonance-free package

IEEE Transactions on Microwave Theory and Techniques

Volumn 54, Issue 2, 2006, Pages 710-716

  Min, Byung Wook ^a,b   Rebeiz, Gabriel M ^a,c  

^a IEEE   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Hermetic package; Package leakage; Package transition; Parasitic resonance; RF microelectromechanical systems (MEMS); Silicon micromachining; Wafer bonding; Wafer scale packaging

Indexed keywords

HERMETIC PACKAGE; PACKAGE LEAKAGE; PACKAGE TRANSITION; PARASITIC RESONANCE; RF MICROELECTROMECHANICAL SYSTEMS (MEMS); SILICON MICROMACHINING; WAFER BONDING; WAFER-SCALE PACKAGING;

GOLD; INSERTION LOSSES; MICROMACHINING; RESONANCE; SILICON WAFERS; WAVEGUIDES;

CHIP SCALE PACKAGES;

EID: 33144484018     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2005.862655     Document Type: Article

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