W-band low-loss wafer-scale package for RF MEMS

35th European Microwave Conference 2005 - Conference Proceedings

Volumn 3, Issue , 2005, Pages 1535-1538

  Min, Byung Wook ^a   Rebeiz, Gabriel M ^b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; GOLD; SILICON WAFERS; WAVEGUIDES; WSI CIRCUITS;

DIELECTRIC INTERLAYERS; GOLD SEALING RINGS; THERMO COMPRESSION BONDING; WAFER SCALE PACKAGE;

MICROELECTROMECHANICAL DEVICES;

EID: 33144466448     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2005.1610244     Document Type: Conference Paper

References (9)

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