MEMS packaging on a budget (fiscal and thermal)

Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems

Volumn 1, Issue , 2002, Pages 287-290

  Cohn, Michael B ^a   Roehnelt, Ryan ^a   Xu, Ji Hai ^a   Shteinberg, Alexander ^a   Cheung, Steven ^a  

^a MicroAssembly Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HERMETIC SEALING; HERMETICITY; IC PACKAGING; LOW TEMPERATURES; MEMS PACKAGING; METAL BONDS; RF-MEMS; SINGULATION;

PACKAGING;

EID: 77956364611     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICECS.2002.1045390     Document Type: Conference Paper

References (6)

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3. nd Ed., ITP, New York, 1997.
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5. Howe, R.T.; Muller, R.S. Integrated resonant-microbridge vapor sensor, international Electron Devices Meeting, San Francisco, CA, USA, 9-12 Dec. 1984. IEEE, 1984. p.213-16.
6. Jourdain, A., DeMoor, P., Pamidighantam, S., Tilmans, A.C., Investigation of the Hermeticity of BCB-Sealed Cavities for Housing (RF-) MEMS Devices, MEMS 2002, January 20-24, 2002, Las Vegas, Nevada.