Flip chip interconnects with electroplated, extended eutectic solder

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 319-323

  Glezen, J H ^a   Naseem, H A ^a   Fritsch, I ^a   Ulrich, R K ^a   Brown, W D ^a   Schaper, L W ^a  

^a 3202 Bell Engineering Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTROPLATING; EUTECTICS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTEGRATED CIRCUIT INTERCONNECTS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; SOLDERING ALLOYS;

BULK PHASIS; ELECTRICAL RESISTANCES; EUTECTIC SOLDERS; FLIP CHIP INTERCONNECTS; REFLOW PROPERTIES; SELF-ALIGNMENT PROPERTIES; SIZE AND SHAPE; SOLDER STRUCTURES;

FLIP CHIP DEVICES;

EID: 85013877873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670801     Document Type: Conference Paper

References (5)

1. Yung, E.K., and Turlik, I., "Electroplated Solder Joints for Flip-Chip Applications", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, No. 3, 1991. U
2. Datta, M., et al., "Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections", Journal of the Electrochemical Society, Vol. 142. No. 11, 1995.
3. Dibbs, M., et al., "Development of Seamless High Off-Chip Connectivity", Proceedings of the 1997 International Symposium on Microelectronics, pp. 138-143, 1997.
4. Lin, K., Chang, S., "Approaching a Uniform Bump Height of the Electroplated Solder Bumps on a Silicon Wafer", EEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, Vol. 19, No. 4, November, 1996.
5. Greer, S.E., "An Extended Eutectic Solder Bump for FCOB", Proceedings of the 1996 Electronics Components Technology Conference (ECTC), pp. 546-551.1996.