Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 81-89

  Johansson, Christian ^a   Uhlig, Steffen ^a   Tageman, Ola ^b   Alping, Arne ^b   Haglund, Joacim ^c   Robertsson, Mats ^a,c   Popall, Michael ^d   Fröhlich, Lothar ^d  

^a LINKÖPING UNIVERSITY   (Sweden)

^b Ericsson Microwave Systems AB   (Sweden)

^c ACREO AB   (Sweden)

^d FRAUNHOFER INSTITUTE FOR SILICATE RESEARCH ISC   (Germany)

Author keywords

High frequency electrical characterization; Microwave circuits; Multilayer thin film technology; ORMOCER

Indexed keywords

CAPACITORS; DIELECTRIC FILMS; DIGITAL FILTERS; INTEGRATED CIRCUIT LAYOUT; MICROSTRIP LINES; MULTILAYERS; OPTICAL INTERCONNECTS; RESONATORS; SUBSTRATES; THIN FILM CIRCUITS;

HIGH FREQUENCY ELECTRICAL PACKAGING; INORGANIC POLYMER THIN FILM; LAMINATE SUBSTRATES; MULTILAYER POLYMER THIN FILM; ORGANIC POLYMER THIN FILM; RING RESONATORS;

MICROWAVE CIRCUITS;

EID: 0037604504     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811548     Document Type: Article

References (23)

1. M. Popall, A. Dabek, M. E. Robertsson, G. Gustafsson, O.-J. Hagel, B. Olsowski, R. Buestrich, L. Cergel, M. Lebby, P. Kiely, J. Joly, D. Lambert, M. Schaub, and H. Reichl, "ORMOCER's new, photo-patternable dielectric and optical materials for MCM-packaging," in Proc. 48th Electron. Comp. Technol. Conf. (ECTC'98), Seattle, WA, May 26-28, 1998, pp. 1018-1025.
2. M. E. Robertsson, O.-J. Hagel, G. Gustafsson, A. Dabek, M. Popall, L. Cergel, P. Wennekers, P. Kiely, M. Lebby, and T. Lindahl, "O/e-MCM packaging with new, patternable dielectric and optical materials," in Proc. 48th Electron. Comp. Technol. Conf. (ECTC'98), Seattle, WA, May 26-28, 1998, pp. 1413-1421.
3. M. E. Robertsson, J. Haglund, C. Johansson, P. Gibaud, D. Lambert, M. Popall, L. Fröhlich, A. Tolvgård, A. Alping, L. Linden, J. Rodekirch, M. I. Zemel, and C. C. Nunes, "Large-area patterning of high-density interconnects by novel UV excimer lithography and photo-patternable ORMOCER dielectrica," in Proc. IMAPS 2001, 13th Eur. Microelectron. Packag. Conf. Exhibition, Strasbourg, Germany, May 30-June 1, 2001, pp. 276-281.
4. R.R. Tummala, Fundamentals of Microsystems Packaging.New York: McGraw-Hill, 2001, p. 723.
5. Experimental results from DONDODEM EU-project, partner confidential report.
6. D. Schönfeldt, O. Rösch, P. Dannberg, A. Bräuer, R. Müller-Fiedler, M. Popall, and R. Buestrich, "Enhanced performance of polymer waveguides by replication and UV-patterning in ORMOCER," Proc. SPIE, vol. 3135, pp. 53-63, 1997.
7. G. Blau, M. T. Gale, and J. Söchtig, "Tunable VCSEL with integrated heater and planar waveguide wavelength monitor," in Proc. Opt. MEMS'00, Kauai, HI, Aug. 27-31, 2000, pp. 83-84.
8. R. Buestrich, F. Kahlenberg, M. Popall, P. Dannberg, R. Müller-Fiedler, and O. Roesch, "ORMOCERs for Optical Interconnection Technology," J. Sol-Gel Sci. Technol., vol. 20, no. 181, pp. 181-186, 2001.
9. R. G. Arnold and D. J. Pedder, "Microwave characterization of microstrip lines and spiral inductors in MCM-D technology," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 15, pp. 1038-1045, Dec. 1992.
10. E. Beyne, R. Van Hoof, T. Webers, S. Brebels, S. Rossi, F. Lechleiter, M. Di Ianni, and O. Ostmann, "High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)," in Microelectron. Int., Mar. 18, 2001.
11. M. Scheffler et al., "LAP: Low cost large area panel processing of MCM-D substrates and packages-achievements and results," in Proc. INTERPACK'01, Kauai, HI, July 8-13, 2001.
12. K. Jain et al., "Large-area, high-throughput, high-resolution lithography systems for flat-panel displays and microelectronic modules," in Proc. SPIE, vol. 3331, 1998, p. 197.
13. L. Fröhlich, R. Buestrich, M. Popall, K. Voigtländer, S. Gaier, O. Rösch, R. Müller-Fiedler, M. Munk, and H. von Zuchlinski, "Inorganic-organic functional polymers for multilayer microwave circuits," in Proc. Mater. Week 2000, Munich, Germany, 2000.
14. G. Gonzalez, Microwave Transistor Amplifiers Analysis and Design, 2nd ed. Englewood Cliffs, NJ: Prentice-Hall, 1997, pp. 240-242.
15. V. B. Krishnamurthy, H. S. Cole, and T. Sitnik-Nieters, "Use of BCB in high frequency MCM interconnects," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 19, pp. 42-47, Feb. 1996.
16. DuPont Microcircuit Materials, DuPont. (2002, May). [Online]. Available: www.dupont.com/mcm/product/charts/chart04.html.
17. J. W. Gipprich, K. A. Leahy, A. J. Martin, E. L. Rich, and K. W. Sparks, "Microwave dielectric constant of a low temperature cofired ceramic," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 14, pp. 732-737, Dec. 1991.
18. D. Li, C. E. Free, K. E. G. Pitt, and P. G. Barnwell, "Simulated and practical behavior of state-of-the-art MCM via structures," in Proc. IEEE Int. Conf. Multichip Modules, 1997.
19. D. M. Pozar, Microwave Engineering, 2nd ed. New York: Wiley, 1998, ch. 4.
20. G. Carchon, K. Vaesen, S. Brebels, W. De Raedt, E. Beyene, and B. Nauwelaers, "Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits," IEEE Trans. Comp. Packag. Technol., vol. 24, pp. 510-519, Sept. 2001.
21. P. Pieters, W. De Raedt, and E. Beyene, "Advances in microwave MCM-D technology," in Proc. IMAPS Nordic 36th Annu. Conf., Helsinki, 1999.
22. G. Morcan, S. S. Ang, T. G. Lenihan, L. W. Schaper, J. P. Parkerson, and W. D. Brown, "Electrical characterization of thin-film integral passive devices on polyamide-based packaging structures," Int. J. Microcirc. Electron. Packag., vol. 21, no. 4, Fourth quarter 1998.
23. P. Guibault, P. Bodö, and M. Scheffler, "Comparison of two cost analysis tools used to estimate the manufacturing cost of HDI substrates," in Proc. IMAPS 13th Euro. Microelectron. Packag. Conf. Exhibition, Strasbourg, Germany, May 30-June 1, 2001.