Fully SMT-compatible optical-I/O package with microlens array interface

Journal of Lightwave Technology

Volumn 21, Issue 1, 2003, Pages 275-280

  Ishii, Yuzo ^a   Tanaka, Nobuyuki ^a   Sakamoto, Takeshi ^a   Takahara, Hideyuki ^a  

^a NTT CORPORATION   (Japan)

Author keywords

Microlens; Optical interconnections; Packaging; Surface mount technology; Vertical cavity surface emitting laser

Indexed keywords

ELECTRONICS PACKAGING; MICROLENSES; OPTICAL INTERCONNECTS; PHOTODIODES; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR LASERS; SURFACE MOUNT TECHNOLOGY;

INTEGRATED CIRCUIT PACKAGING; OPTOELECTRONIC PACKAGE; VERTICAL CAVITY SURFACE EMITTING LASER;

INTEGRATED OPTOELECTRONICS;

EID: 0037259044     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/JLT.2003.808611     Document Type: Article

References (11)

1. International Technology Roadmap for Semiconductors, Semiconductor Ind. Assoc. Handbook, 2001.
2. A. F. J. Levi, "Optical interconnects in systems," Proc. IEEE, vol. 88, pp. 750-757, June 2000.
3. M. Brunfaut, W. Meeus, J. Dambre, R. Bockstaele, J. Van Campenhout, H. Melchiour, J. Hall, A. Neyer, P. Heremans, J. Van Koetsem, R. King, H. Thienpont, L. Vanwassenhove, and R. Baets, "Demonstrating POF based optoelectronic interconnect in a multi-FPGA prototype system," in Proc. ECOC, 2001, pp. 298-299.
4. T. Yoshikawa, I. Hatakeyama, K. Miyoshi, K. Kurata, J. Sasaki, N. Kami, T. Sugimoto, M. Fukaishi, K. Nakamura, K. Tanaka, H. Nishi, and T. Kudoh, "Optical-interconnections as an IP macro of a CMOS library," in Proc. Hot Interconnects, vol. 9, 2001, pp. 31-35.
5. S. C. Esener, "Implementation and prospects for chip-to-chip free-space optical interconnects," in Tech. Dig. Int. Electron Devices Meeting, 2001, pp. 23-5-1-4.
6. H. Sasaki, K. Kotani, H. Wada, T. Takamori, and T. Ushikubo, "Scalability analysis of diffractive optical element-based free-space photonic circuits for interoptoelectronic chip interconnections," Appl. Opt., vol. 40, pp. 1843-1855, 2001.
7. L. Wu, F. Li, S. Tang, B. Bihari, and R. T. Chen, "Compression-molded three-dimensional tapered polymeric waveguides for low-loss optoelectronic packaging," IEEE Photon. Technol. Lett., vol. 9, pp. 1601-1603, Dec. 1997.
8. D. Krabe, F. Ebeling, N. Arndt-Staunfenbiel, G. Lang, and W. Scheel, "New technology for electrical/optical systems on module and board level: The EOCB approach," in Proc. ECTC, 2000, pp. 970-975.
9. Y. Ishii, S. Koike, Y. Arai, and Y. Ando, "SMT-compatible optical-I/O packaging for chip-level optical interconnects," in Proc. ECTC, 2001, pp. 870-875.
10. ____, "SMT-compatible large-tolerance "OptoBump" interface for interchip optical interconnections," IEEE Trans. Adv. Packag., to be published.
11. ____, "Hybrid integration of polymer microlens with VCSEL using drop-on-demand technique," Proc. SPIE, vol. 3952, pp. 364-374, 2000.