Reliability of metallized ceramic packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 685-691

  Subbarayan, Ganesh ^a,b   Ferrill, M G ^c   DeFoster, Steven M ^a,c  

^a IEEE

^b UCB 450   (United States)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; RELIABILITY; THERMAL CYCLING;

CIRCUIT LINE ABNORMALITIES; ENVIRONMENTAL STRESS TESTS; METALLIZED CERAMIC PACKAGES;

ELECTRONICS PACKAGING;

EID: 0030216690     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533912     Document Type: Article

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