Effect of Cu addition to Sn-Ag lead-free solder on interfacial stability with Fe-42Ni

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 714-720

  Hwang, Chi Won ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Copper; Iron 42 nichkel; Lead free solder; Nichkel; Reaction interface; Silver; Tin; Tin silver copper solder

Indexed keywords

COPPER ALLOYS; CRACK PROPAGATION; ELECTRONICS PACKAGING; EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLIDIFICATION; TIN ALLOYS;

IRON-42 NICKEL; LEAD-FREE SOLDERS; REACTION INTERFACE; TIN-SILVER-COPPER;

SOLDERING ALLOYS;

EID: 2442432528     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.714     Document Type: Article

References (23)

1. K. Suganuma: Current Opinion in Solid State and Mater. Sci. 5 (2001) 55-64.
2. M. McCormack and S. Jin: J. Electron. Mater. 23 (1994) 635-640.
3. M. A. Kinna: Int. SAMPLE Electron. Conf. 6 (1992) 547-555.
4. D. R. Stelmak and J. I. Vesce: Natl. Electron. Packag. Prod. Conf. 1 (1995) 286-291.
5. C. W. Hwang, K. Suganuma, J. G. Lee and H. Mori: J. Electron. Mater. 32 (2003) 52-62.
6. C. W. Hwang, K. S. Kim and K. Suganuma: J. Electron. Mater. 32 (2003) 1249-1256.
7. K. Suganuma, K. Niihara, T. Shoutoku and Y. Nakamura: J. Mater. Res. 13 (1998) 2859-2865.
8. C. W. Hwang, K. Suganuma, M. Kiso and S. Hashimoto: J. Mater. Res. 18 (2003) 2540-2543.
9. S. Chada, R. A. Foumelle, W. Laub and D. Shangguan: J. Electron. Mater. 29 (2000) 1214-1221.
10. A. J. Sunwoo, J. W. Morris and G. K. Lucey: Metal. Trans. 23A (1992) 1323-1332.
11. Y. C. Chan, Alex C. K. So and J. K. L. Lai: Mater. Sci. Eng. B 55 (1998) 5-13.
12. S. Ahat, L. Du, M. Sheng, L. Luo, W. Kempe and J. Freytag: J. Electron. Mater. 29 (2000) 1105-1109.
13. J. D. Bernal: Nature 122 (1928) 54.
14. S. K. Kang and V. Ramaehandran: Scr. Metal. 14 (1980) 421-424.
15. K. Suganuma and Y. Nakamura: J. Japan Inst. Metals 59 (1995) 1299-1305.
16. C. W. Hwang, K. Suganuma, J. G. Lee and H. Mori: J. Mater. Res. 18 (2003) 1202-1210.
17. C. W. Hwang, K. Suganuma, E. Saiz and A. P. Tomsia; Trans. JWRI30 (2001) 167-172.
18. E. Saiz, C. W. Hwang, K. Suganuma and A. P. Tomsia: Acta Mater. 51 (2003) 3185-3197.
19. I. E. Anderson, B. A. Cook, J. H. Harringa and R. L. Terpstra: J. Electron. Mater. 31 (2002) 1166-1174.
20. D. Gur and M. Bamberger: Acta mater. 46 (1998) 4917-4923.
21. J. V. Castell-Evans and S. Wach: J. Iron and Steel Inst. 211 (1973) 880-889.
22. K. S. Kim, S. H. Huh and K. Suganuma: Mater. Sci. Eng. A333 (2002) 106-114.
23. D. W. Henderson, T. Gosselin, A. Sarkhel, S. K. Kang, W. K. Choi and D. Y. Shih: J. Mater. Res. 17 (2002) 2775-2778.