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Volumn , Issue , 2005, Pages 905-909

Experimental verification of non-linear finite element analysis for combined hygroscopic and thermo-mechanical stresses

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT TRANSFER; INTERFEROMETRY; MOISTURE; PLASTIC DEFORMATION; REAL TIME SYSTEMS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

EID: 32044461550     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (11)
  • 3
    • 4444259740 scopus 로고    scopus 로고
    • Characterization of hygroscopic swelling behavior of mold compounds and plastic packages
    • E. Stellrecht, B. Han, M. Pecht, "Characterization of hygroscopic swelling behavior of mold compounds and plastic packages," IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, pp. 499-506,2004.
    • (2004) IEEE Transactions on Components and Packaging Technologies , vol.27 , Issue.3 , pp. 499-506
    • Stellrecht, E.1    Han, B.2    Pecht, M.3
  • 5
    • 0030168482 scopus 로고    scopus 로고
    • Moisture diffusion and heat transfer in plastic IC packages
    • A. O. lay and T. Lin, "Moisture Diffusion and Heat Transfer in Plastic IC Packages", IEEE Trans. CPMT - Part A, Vol. 19, No. 2, 1996.
    • (1996) IEEE Trans. CPMT - Part A , vol.19 , Issue.2
    • Lay, A.O.1    Lin, T.2
  • 6
    • 0031234029 scopus 로고    scopus 로고
    • Moisture absorption and desorption predictions for plastic ball grid array packages
    • J. E. Galloway and B. M. Miles, "Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages", IEEE CMPT-PART A, Vol. 20, No. 3, pp. 274-279, 1997.
    • (1997) IEEE CMPT-Part A , vol.20 , Issue.3 , pp. 274-279
    • Galloway, J.E.1    Miles, B.M.2
  • 7
    • 0012647310 scopus 로고    scopus 로고
    • The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging
    • H. Wong, R. Rajoo, S. W. Koh, T. B. Lim, "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging, Journal of Electronic Packaging, Vol. 124, pp. 122-126,2002.
    • (2002) Journal of Electronic Packaging , vol.124 , pp. 122-126
    • Wong, H.1    Rajoo, R.2    Koh, S.W.3    Lim, T.B.4
  • 8
    • 0034479574 scopus 로고    scopus 로고
    • FEA simulation on moisture absorption in PBGA packages under various moisture pre-conditioning
    • L. T. Fai, "FEA Simulation on Moisture Absorption in PBGA Packages under Various Moisture Pre-Conditioning," Proceedings of the Electronic Components and Technology Conference, pp. 1078-1082, 2000.
    • (2000) Proceedings of the Electronic Components and Technology Conference , pp. 1078-1082
    • Fai, L.T.1
  • 9
    • 33847314702 scopus 로고    scopus 로고
    • Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses
    • Samson Yoon, Bongtae Han and Seungmin Cho and Chang-Soo Jang, "Non-linear Finite Element Analysis for Electronic Packages Subjected to Combined Hygroscopic and Thermo-mechanical Stresses", Proceedings of IPACK'05, 2005
    • (2005) Proceedings of IPACK'05
    • Yoon, S.1    Han, B.2    Cho, S.3    Jang, C.-S.4
  • 11
    • 0347533783 scopus 로고    scopus 로고
    • Photoelastic investigation of bimaterial interfacial stresses induced by thermal loading
    • Nov
    • Wang, W.-C.; Lin, J.-C, "Photoelastic Investigation of Bimaterial Interfacial Stresses Induced by Thermal Loading", Strain, Nov, 2003, Vol. 39 Issue 4, p.143.
    • (2003) Strain , vol.39 , Issue.4 , pp. 143
    • Wang, W.-C.1    Lin, J.-C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.