Microreplication techniques using soft lithography

Microelectronic Engineering

Volumn 75, Issue 2, 2004, Pages 194-200

  Chung, Sungil ^a   Im, Yonggwan ^b   Choi, Jaeyoung ^b   Jeong, Haedo ^b  

^a LG Electronics Inc   (South Korea)

^b Pusan National University   (South Korea)

Author keywords

Bismuth alloys; Dicing; Epoxy resin; Etching; Glass paste; Microreplication; Microstereolithography

Indexed keywords

BISMUTH ALLOYS; EPOXY RESINS; LITHOGRAPHY; MICROSTRUCTURE; MOLDS; REACTIVE ION ETCHING; SILICONES; SYNTHETIC RUBBER; VISCOSITY;

DICING; GLASS PLATES; MICROREPLICATION; MICROSTEREOLITHOGRAPHY;

MICROELECTRONICS;

EID: 3142782287     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.05.012     Document Type: Article

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