A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape using the Micro-Molding Method

Key Engineering Materials

Volumn 257-258, Issue , 2004, Pages 413-416

  Choi, J ^a   Kim, H ^b   Park, J ^c   Chung, S ^a   Jeong, H ^a   Kinoshita, M ^c  

^a Pusan National University   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c Rodel Nitta Company   (Japan)

Author keywords

Chemical Mechanical Polishing; CMP; Micro Molding Method; Polishing Pad; Self Conditioning

Indexed keywords

ABRASIVES; HARDNESS; HYDROPHILICITY; MOLDING; POLYMERS; PORE SIZE; SLURRIES; SWELLING;

MICRO-MOLDING; POLISHING PADS;

CHEMICAL MECHANICAL POLISHING;

EID: 17644449401     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.257-258.413     Document Type: Article

References (3)

1. H. Hocheng, Y.L. Huang and L.J. Chen: J. of Electrochem. Soc., Vol. 146 (1999), p. 4236.
2. J.M. Steigwald: Chemical Mechanical Planarization of Microelectronic Materals (Elsevier, NY 1987).
3. J.Y. Choi, H.Y. Kim, J.H. Park, H.D. Jeong and H.D. Seo: Key Engineering Materials, Vol. 238-239 (2003), p. 247.