Removal characteristics of hillock on SnO2 thin film by chemical mechanical polishing process

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 23, Issue 4, 2005, Pages 1133-1136

  Seo, Yong Jin ^a   Kim, Nam Hoon ^b   Chang, Eui Goo ^c   Park, Jinseong ^b   Choi, Gwon Woo ^b   Lee, Woo Sun ^b  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; CHEMICAL SENSORS; MICROSTRUCTURE; MORPHOLOGY; SILICA; SLURRIES; TIN COMPOUNDS;

HILLOCK; ROOT MEAN SQUARE; SILICA SLURRY;

THIN FILMS;

EID: 31044456551     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1931707     Document Type: Conference Paper

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