Mechanical and thermal properties of physical vapour deposited alumina films: Part I thermal stability

Journal of Materials Science

Volumn 39, Issue 15, 2004, Pages 4799-4807

  Thurn, J ^a,b   Cook, R F ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

^b SEAGATE TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; PHYSICAL VAPOR DEPOSITION; SPUTTER DEPOSITION; SUBSTRATES; THERMAL CYCLING; THERMAL STRESS; THERMODYNAMIC STABILITY;

BIAS VOLTAGE; CHAMBER PRESSURE; SPUTTER SOURCES;

THIN FILMS;

EID: 3242787227     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000035318.95497.d1     Document Type: Article

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