Lead-free 0201 manufacturing, assembly and reliability test results

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 244-262

  Ramkumar, S Manian ^a   Ghaffarian, Reza ^b   Varanasi, Arun ^a  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DATA STRUCTURES; ELECTRIC POWER SYSTEM INTERCONNECTION; POLYCHLORINATED BIPHENYLS; PRODUCT DESIGN; SHEAR STRENGTH; SOLDERED JOINTS; TEST FACILITIES;

MANUFACTURING DEFECTS; PAD DESIGN; SOLDER PASTE VOLUME;

ELECTRIC INSULATION TESTING;

EID: 30844447689     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.09.007     Document Type: Article

References (19)

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