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Volumn 2005, Issue , 2005, Pages 94-99
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Lead-free 0201 assembly and reliability
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Author keywords
0201 Assembly; Lead free process; Lead free surface finish; Modified apertures; Thermal aging; Thermal cycle
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Indexed keywords
0201 ASSEMBLY;
LEAD-FREE PROCESS;
LEAD-FREE SURFACE FINISH;
MODIFIED APERTURES;
THERMAL AGING;
THERMAL CYCLE;
DESIGN FOR TESTABILITY;
LEAD;
NICKEL;
RELIABILITY;
RESISTORS;
SOLDERING ALLOYS;
TIN;
ASSEMBLY;
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EID: 30844463940
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISAPM.2005.1432055 Document Type: Conference Paper |
Times cited : (5)
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References (9)
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