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Volumn 2005, Issue , 2005, Pages 94-99

Lead-free 0201 assembly and reliability

Author keywords

0201 Assembly; Lead free process; Lead free surface finish; Modified apertures; Thermal aging; Thermal cycle

Indexed keywords

0201 ASSEMBLY; LEAD-FREE PROCESS; LEAD-FREE SURFACE FINISH; MODIFIED APERTURES; THERMAL AGING; THERMAL CYCLE;

EID: 30844463940     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432055     Document Type: Conference Paper
Times cited : (5)

References (9)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.