Stabilization of high ionic strength slurries using surfactant mixtures: Molecular factors that determine optimal stability

Journal of Colloid and Interface Science

Volumn 256, Issue 1, 2002, Pages 143-152

  Palla, B J ^a   Shah, D O ^b  

^a TEXAS INSTRUMENTS   (United States)

^b UNIVERSITY OF FLORIDA   (United States)

Author keywords

Chemical mechanical polishing (CMP); Dispersion stability; Mixed surfactant synergism; Stabilization model.

Indexed keywords

ADSORPTION; CHEMICAL MECHANICAL POLISHING; COAGULATION; HYDROPHILICITY; HYDROPHOBICITY; IONIC STRENGTH; SLURRIES; SURFACE ACTIVE AGENTS;

DESTABILIZATION;

COLLOIDS;

ALUMINUM OXIDE; COPPER; IONIC SURFACTANT; NONIONIC SURFACTANT; TUNGSTEN;

ADSORPTION; ARTICLE; CONCENTRATION RESPONSE; HYDROPHOBICITY; IONIC STRENGTH; PARTICLE SIZE; PRIORITY JOURNAL; SEDIMENTATION; SURFACE PROPERTY;

EID: 0036973182     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1006/jcis.2002.8648     Document Type: Article

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