A vertical convex corner compensation and non {111} crystal planes protection for wet anisotropic bulk micromachining process

Journal of Micromechanics and Microengineering

Volumn 14, Issue 6, 2004, Pages 806-813

  Chu, Huai Yuan ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CRYSTAL STRUCTURE; DOPING (ADDITIVES); MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICA; SILICON WAFERS; THIN FILMS;

ANISOTROPIC ETCHING; CONVEX CORNERS; CRYSTAL PLANES; DEEP REACTIVE ION ETCHING (DRIE);

MICROMACHINING;

EID: 3042608191     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/6/007     Document Type: Article

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