-
1
-
-
0026836537
-
Reliability defect detection and screening during processing - Theory and implementation
-
H. H. Huston, C. P Clarke, "Reliability Defect Detection and Screening During Processing - Theory and Implementation", International Reliability Physics Symposium, 1992, pp. 268. 1992.
-
(1992)
International Reliability Physics Symposium, 1992
, pp. 268
-
-
Huston, H.H.1
Clarke, C.P.2
-
2
-
-
0027146999
-
Reliability, yield and quality correlation for a particular failure mechanism
-
J. G. Prendergast, "Reliability, Yield and Quality Correlation for a Particular Failure Mechanism", International Reliability Physics Symposium, 1993, pp. 87.
-
(1993)
International Reliability Physics Symposium
, pp. 87
-
-
Prendergast, J.G.1
-
4
-
-
0029700580
-
Relation between yield and reliability of integrated circuits: Experimental results and application to continuous early failure rate reduction programs
-
F. Kuper, J. van der Pol, E. Ooms, T. Johnson, R. Wijburg, W. Koster, D. Johnston, "Relation Between Yield and Reliability of Integrated Circuits: Experimental Results and Application to Continuous Early Failure Rate Reduction Programs", International Reliability Physics Symposium, 1996, pp. 17.
-
(1996)
International Reliability Physics Symposium
, pp. 17
-
-
Kuper, F.1
Van der Pol, J.2
Ooms, E.3
Johnson, T.4
Wijburg, R.5
Koster, W.6
Johnston, D.7
-
5
-
-
0031674382
-
Impact of latent defects at electrical test on the yield-reliability relation and applications to bum-in elimination
-
J. van der Pol, E. Ooms, T. van't Hof, F. Kuper, "Impact of Latent Defects at Electrical Test on the Yield-Reliability Relation and Applications to Bum-in Elimination", IEEE, 1998, pp. 370.
-
(1998)
IEEE
, pp. 370
-
-
Van der Pol, J.1
Ooms, E.2
Van 'T Hof, T.3
Kuper, F.4
-
6
-
-
0032628982
-
An overview of manufacturing yield and reliability modeling for semiconductor products
-
Way Kuo and Taeho Kim, "An Overview of Manufacturing Yield and Reliability Modeling for Semiconductor Products," IEEE, 1999, pp 1329.
-
(1999)
IEEE
, pp. 1329
-
-
Kuo, W.1
Kim, T.2
-
7
-
-
3042514416
-
Microprocessor reliability performance as a function of die location for a 0.25 micron, five layer metal CMOS logic process
-
W. C. Riordan, R. Miller, J. M. Sherman, J. Hicks, "Microprocessor Reliability Performance as a Function of Die Location for a 0.25 micron, Five Layer Metal CMOS Logic Process", IEEE, 1999.
-
(1999)
IEEE
-
-
Riordan, W.C.1
Miller, R.2
Sherman, J.M.3
Hicks, J.4
-
8
-
-
84987266075
-
A statistical distribution function of wide applicability
-
W. Weibull, "A Statistical Distribution Function of Wide Applicability," Journal of Applied Mechanics, 1951, pp. 293-297.
-
(1951)
Journal of Applied Mechanics
, pp. 293-297
-
-
Weibull, W.1
-
11
-
-
84895110189
-
The effectiveness of IDDQ and high voltage stress for burn-in elimination
-
R. Kawahara, O. Nakayama, T. Kurasawa, "The Effectiveness of IDDQ and High Voltage Stress for Burn-In Elimination," IEEE, 1996, pp. 9-13.
-
(1996)
IEEE
, pp. 9-13
-
-
Kawahara, R.1
Nakayama, O.2
Kurasawa, T.3
-
12
-
-
84886910586
-
Evaluation of early failure screening methods
-
T. Barrette, V. Bhide, K. De, M. Stover, E. Sugasawara, "Evaluation of Early Failure Screening Methods," IEEE, 1996, pp. 14-17
-
(1996)
IEEE
, pp. 14-17
-
-
Barrette, T.1
Bhide, V.2
De, K.3
Stover, M.4
Sugasawara, E.5
-
13
-
-
0026139718
-
Burn-in effectivness - Theory and measurement
-
H. H. Huston, M. H. Wood, V. M. DePalma, "Burn-in Effectivness - Theory and Measurement," International Reliability Physics Symposium, 1991, pp. 271-276.
-
(1991)
International Reliability Physics Symposium
, pp. 271-276
-
-
Huston, H.H.1
Wood, M.H.2
DePalma, V.M.3
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