The effect of model building on the accuracy of fatigue life predictions in electronic packages

Microelectronics Reliability

Volumn 44, Issue 1, 2004, Pages 115-127

  Towashiraporn, P ^a   Subbarayan, G ^b   McIlvanie, B ^c   Hunter, B C ^d   Love, D ^e   Sullivan, B ^f  

^a UCB 450   (United States)

^b PURDUE UNIVERSITY   (United States)

^c Jabil Circuit   (United States)

^d Sun StorageTek   (United States)

^e SUN MICROSYSTEMS   (United States)

^f High Density Packaging Users Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; BOUNDARY CONDITIONS; CORRELATION METHODS; ERROR ANALYSIS; FATIGUE OF MATERIALS; MICROELECTRONICS; MICROPROCESSOR CHIPS; MICROSTRUCTURE; MODEL BUILDINGS; NATURAL CONVECTION; RELIABILITY; SOLDERED JOINTS;

POWER CYCLING; SPATIAL REFINEMENT; TEMPORAL REFINEMENT;

ELECTRONICS PACKAGING;

EID: 0347622674     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.08.012     Document Type: Article

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