Reducing accelerated test time: Use of vibration loading to accelerate aging damage

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Sharma, Pradeep ^a   Natarajan, Rajesh ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CORROSION; FAILURE ANALYSIS; INTEGRATED CIRCUIT TESTING; PRINTED CIRCUIT BOARDS; VIBRATIONS (MECHANICAL);

ACCELERATED TESTING; AGING DAMAGE;

ELECTRONICS PACKAGING;

EID: 0342732947     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Dasgupta, A., 1996, " Combined Temperature and Humidity Accelerated Testing of Assemblies," Technical Report, CALCE EPSC, University of Maryland, College Park, MD.
2. Dujari, P., Dasgupta, A., Balachandran, B., 1996, "Comparison Between Repetitive and Electrodynamic Vibration Test Machines for Accelerated Stress Application," Workshop on Accelerated Stress Testing, Sponsored by IEEE Components, October 17-18, Packaging, and Manufacturing Technology Society, Ottawa, Canada.
3. Lau, J., (ed), 1991, "Solder Joint Reliability," Van Nostrand Reinhold, New York City, NY
4. th Annual Workshop on Accelerated Stress Testing, Sponsored by IEEE CPMT, September 22-24, Pasadena, California
5. Upadhyayula, K. and Dasgupta, A., 1996, "Accelerated Life Test Development for Combined Stresses," VIII International Congress on Experimental/Numerical Mechanics in Electronic Packaging, June 10-13, Sponsored by Society of Experimental Mechanics, Nashville, TN