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Volumn 41, Issue 4, 2001, Pages 553-562
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Reliability studies of two flip-chip BGA packages using power cycling test
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
ELECTRONICS PACKAGING;
FAILURE ANALYSIS;
LAMINATES;
SOLDERED JOINTS;
SUBSTRATES;
MODIFIED COFFIN-MANSON EQUATION;
POWER CYCLING TESTS;
FLIP CHIP DEVICES;
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EID: 0035310645
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-2714(00)00252-3 Document Type: Article |
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Times cited : (15)
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References (8)
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