Reliability test methodology using thermo-mechanical deflection

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Pang, John H L ^a   Ang, K H ^a   Wang, Z P ^b   Shi, X Q ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE TESTING; MATHEMATICAL MODELS; SOLDERED JOINTS;

COFFIN-MANSON EQUATIONS;

ELECTRONICS PACKAGING;

EID: 0343167483     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Solomon H.D. "Fatigue of 60/40 Solder", Transactions on Components; Hybrids, and Manufacturing Technology, Vol. CHMT-9, No 4, December 1986
2. Lau J.H. " Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, 1991.
3. Zubelewicz A et al, "Mechanical Deflection System -An Innovative Test Method For SMT Assemblies", EEP -Vol 10-2, Advances in Electronic Packaging, ASME 1995.