Alternative accelerated testing method for localization of solder fatigue failures on electronic circuit cards

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Sealing, Scott ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; FAILURE ANALYSIS; INTEGRATED CIRCUIT TESTING; LAMINATES; PIEZOELECTRIC DEVICES; SEMICONDUCTOR DEVICE TESTING; SENSORS; STRESS ANALYSIS; SUBSTRATES; VIBRATIONS (MECHANICAL);

ACCELERATED TESTING METHODS; ELECTRONIC CIRCUIT CARDS; PIEZOELECTRIC EXCITATION SYSTEMS; SOLDER FATIGUE FAILURES;

ELECTRONICS PACKAGING;

EID: 0342732932     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Schutt, J., 1996, "Vibration Testing of Electronic Assemblies," Electronic Packaging & Production, Vol. 36, No. 13, pp. 20-26.
2. Crawley, E.F., and de Luis, J., 1987, "Use of Piezoelectric Actuators as Elements of Intelligent Structures," AIAA Journal, Vol. 25, No. 10, pp. 1373-1385.
3. Dimitriadis, E.K., Fuller, C.R., and Rogers, C.A., 1991, "Piezoelectric Actuators for Distributed Vibration Excitation of Thin Plates," Transactions of the ASME, Journal of Vibration & Acoustics, Vol. 113.
4. Tzou, H.S., 1993, "Piezoelectric Shells, Distributed Sensing and Control of Continua," Kluwer Academic Publishers, Netherlands.
5. Upadhyayula, K., and Dasgupta, A., 1998, "Guidelines for Physics-of-Failure Based Accelerated Stress Testing," Presented at the Reliability and Maintainability symposium, Calif.