Power-delivery networks optimization with thermal reliability integrity

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2004, Pages 124-131

  Wang, Ting Yuan ^a   Tsai, Jeng Liang ^a   Chen, Charlie Chung Ping ^b  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Optimization; Power Ground; Reliability; Self consistent Constraint; Self heating; Thermal

Indexed keywords

SELF CONSISTENT CONSTRAINT; SELF-HEATING;

ALGORITHMS; CURRENT DENSITY; ELECTROMIGRATION; HEAT CONDUCTION; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; OPTIMIZATION; RELIABILITY; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; TOPOLOGY;

VLSI CIRCUITS;

EID: 2942672237     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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