Intra-wafer CDU characterization to determine process and focus contributions based on Scatterometry metrology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5378, Issue , 2004, Pages 93-104

  Dusa, Mircea ^a   Moerman, Richard ^b   Singh, Bhanwar ^c   Friedberg, Paul ^c   Hoobler, Ray ^d   Zavecz, Terry ^e  

^a ASML US Inc   (United States)

^b ASML   (Netherlands)

^c ADVANCED MICRO DEVICES   (United States)

^d NANOMETRICS INC   (United States)

^e TEA Systems   (United States)

Author keywords

CDU; Diffractive OCD; Feature response; Process disturbances; Spatial covariance; Spatial distribution; SWA

Indexed keywords

CDU; DIFFRACTIVE OCD; FEATURE RESPONSE; PROCESS DISTURBANCES; SPATIAL COVARIANCE; SPATIAL DISTRIBUTION; SWA;

CORRELATION METHODS; LITHOGRAPHY; MAPPING; POLYNOMIALS; SILICON WAFERS; THIN FILMS;

MEASUREMENT THEORY;

EID: 2942670511     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.543786     Document Type: Conference Paper

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