Challenges for structural stability of ultra-low- k -based interconnects

Microelectronic Engineering

Volumn 75, Issue 1, 2004, Pages 54-62

  Iacopi, F ^a,b   Brongersma, S H ^a   Vandevelde, B ^a   O'Toole, M ^c   Degryse, D ^a,d   Travaly, Y ^a   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c TRINITY COLLEGE DUBLIN   (Ireland)

^d GHENT UNIVERSITY   (Belgium)

Author keywords

Adhesion; Creep; Interconnects; Plasticity; Porous low k films; Stresses

Indexed keywords

ADHESION; CREEP; DIELECTRIC RELAXATION; ELASTIC MODULI; HARDNESS; INTERFACES (MATERIALS); PLASTICITY; POROUS MATERIALS; STRESSES; THERMAL CYCLING; THERMAL EXPANSION; THIN FILMS;

INTERCONNECTS; POROUS LOW-K FILMS; THERMAL EXPANSION COEFFICIENT;

DIELECTRIC FILMS;

EID: 2942542845     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2003.09.011     Document Type: Conference Paper

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