Optimization of thermal resistance in Quasi Monolithic Integration Technology (QMIT) structure

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2001, Pages 12-17

  Joodaki, M ^a   Kompa, G ^a   Hillmer, H ^a   Kassing, R ^a  

^a UNIVERSITY OF KASSEL   (Germany)

Author keywords

wave and mm wave circuits; Hybrid and monolithic integration technology; Thermal resistance

Indexed keywords

COMPUTER SIMULATION; ETCHING; FINITE ELEMENT METHOD; HEAT RESISTANCE; METALLIZING; MICROWAVE CIRCUITS; OPTIMIZATION; SILICON WAFERS; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

QUASI MONOLITHIC INTEGRATION TECHNOLOGY (QMIT);

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0035013807     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)