Heat transfer and thermal stress analysis in the new generation quasi-monolithic integration technology (QMIT)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 590-596

  Joodaki, Mojtaba ^a   Senyildiz, Teoman ^a   Kompa, Günter ^a   Hillmer, Hartmut ^a  

^a UNIVERSITY OF KASSEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; ELECTROPLATING; FINITE ELEMENT METHOD; HEAT TRANSFER; NETWORKS (CIRCUITS); POLYIMIDES; SENSORS; THERMAL STRESS;

QUASI-MONOLITHIC INTEGRATION TECHNOLOGY (QMIT);

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0036297020     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Simulation and measurement of thermal stress in quasi-monolithic integration technology (QMIT)
2. GaAs FET characterization in a quasi-monolithic Si environment
3. New generation quasi-monolithic integration technology