Board level solder reliability vs. Ramp rate & dwell time during temperature cycling

IEEE International Reliability Physics Symposium Proceedings

Volumn 2003-January, Issue , 2003, Pages 447-451

  Zhai, Charlie J ^a   Sidharth, S ^a   Blish, Richard ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN OF EXPERIMENTS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; RELIABILITY; SOLDERED JOINTS; TESTING;

ACCELERATION FACTORS; MEAN TIME TO FAILURE; NON-LINEAR RELATIONSHIPS; SOLDER JOINT FATIGUE; SOLDER RELIABILITY; TEMPERATURE CYCLING; TEMPERATURE CYCLING TESTS; TEMPERATURE PROFILES;

FINITE ELEMENT METHOD;

EID: 28444484134     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2003.1197789     Document Type: Conference Paper

References (6)

1. Darveaux, R, et al., Ball Grid Array Technology, editor John Lau, McGraw-Hill, Inc., New York, 1995, ch 13, pp 379-442.
2. Darveaux, R, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation", Proceedings of the IEEE ECTC, 2000, pp 1048-1058.
3. Solomon, H. Tolksdorf, "Energy Approach to the'Fatigue of 60/40 Solder: Part I - Influence of Temperature and Cycle Frequency", vol 117, 1995, pp 130-135
4. Blish, R. "Temperature Cycling and Thermal Shock Failure Rate Modeling," Proc of IEEE Rel Phys. Symp., 35, 1997, pp. 110-117.
5. Attarwala, A.I. and Engelmaier, W., "Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards", IEEE Trans of CHMT, Volume: 12 Issue: 2, Jun 1989, pp 284-296.
6. Shi, X.Q., Pang, H.L.J., Zhou, W. and Wang, Z.P., "Modified energy-based low cycle fatigue model for eutectic solder alloy", Scripta Materialia, v 41 n 3, 1999. p 289-296.