Lead-free compatible underfill materials for flip chip applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 417-424

  Chee, Choong Kooi ^a   Chin, Yoong Tatt ^a   Sterrett, Terry ^b   He, Yi ^b   Sow, H P ^a   Manepali, Rahul ^b   Chandran, Dennis ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CAPILLARY FLOW; FLIP CHIP DEVICES; HIGH TEMPERATURE EFFECTS; RELIABILITY THEORY; STRESS ANALYSIS;

UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0036296071     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008130     Document Type: Article

References (8)

1. The underfill processing technologies for flip chip packaging
2. Some factors that affect performance of flip chip underfills
3. Characterisation and evaluation of the underfill encapsulants for flip chip assembly
4. Special characteristic of future flip chip underfill materials and process
5. Design of encapsulating materials for advanced area bump packaging
6. Characterisation of molded underfill for flip chip ball grid array packages
7. On the performance of epoxy molding compounds for flip chip transfer molding encapsulation
8. Thermomechanical properties of IC molding compounds